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Industry Sharing Session : Wafer-Level Packaging and Panel-Level Packaging Solutions for Advanced Packaging

Name: Industry Sharing Session : Wafer-Level Packaging and Panel-Level Packaging Solutions for Advanced Packaging
Start: 2024-11-21T11:00:00+08:00
End: 2024-11-21T12:00:00+08:00
Location: Sakura Room, Level 4, MJIIT

November 21, 2024 @ 11:00 am - 12:00 pm

Details

Date: November 21, 2024
Time:
11:00 am - 12:00 pm
Event Category: KNOWLEDGE ENRICHMENT

Venue

Sakura Room, Level 4, MJIIT

Organizer

Malaysia-Japan International Institute of Technology (MJIIT)